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Obsolete - Not Recommended for New Designs
U630H16XS
HardStore 2K x 8 nvSRAM Die
Features Description The U630H16 has two separate modes of operation: SRAM mode and non-volatile mode, determined by the state of the NE pad. In SRAM mode, the memory operates as an ordinary static RAM. In non-volatile operation, data is transferred in parallel from SRAM to EEPROM or from EEPROM to SRAM. In this mode SRAM functions are disabled. The U630H16 is a fast static RAM (25, 35, 45 ns), with a non-volatile electrically erasable PROM (EEPROM) element incorporated in each static memory cell. The SRAM can be read and written an unlimited number of times, while independent non-volatile data resides in EEPROM. Data transfers from the SRAM to the EEPROM (the STORE operation), or from the EEPROM to the SRAM (the RECALL operation) are initiated through the state of the NE pad. The U630H16 combines the high performance and ease of use of a fast SRAM with non-volatile data integrity. Once a STORE cycle is initiated, further input or output are disabled until the cycle is completed. Internally, RECALL is a two step procedure. First, the SRAM data is cleared and second, the non-volatile information is transferred into the SRAM cells. The RECALL operation in no way alters the data in the EEPROM cells. The non-volatile data can be recalled an unlimited number of times. The chips are tested with a restricted wafer probe program at room temperature only. Untested parameters are marked with a number sign (#).
* * * * * * * * * * * * * * *
High-performance CMOS nonvolatile static RAM 2048 x 8 bits 25, 35 and 45 ns Access Times 12, 20 and 25 ns Output Enable Access Times Hardware STORE Initiation (STORE Cycle Time < 10 ms) Automatic STORE Timing 106 STORE cycles to EEPROM 100 years data retention in EEPROM Automatic RECALL on Power Up Hardware RECALL Initiation (RECALL Cycle Time < 20 s) Unlimited RECALL cycles from EEPROM Unlimited SRAM Read and Write Single 5 V 10 % Operation Operating temperature ranges: 0 to 70 C -40 to 85 C QS 90000 Quality Standard ESD protection > 2000 V (MIL STD 883C M3015.7-HBM)
Pad Configuration
A5 A4 A6 A7 NE VCC VBND W HSB A8 A9 W
Pad Description
A3
G
Signal Name
A0 - A10 DQ0 - DQ7 E G W NE VCC VSS VBND
Signal Description
Address Inputs Data In/Out Chip Enable Output Enable Write Enable Nonvolatile Enable Power Supply Voltage Ground HardStore type enable
A2
A10
A1 A0 DQ0 DQ1 DQ2 VSS VCC DQ3 DQ4 DQ5 DQ6 DQ7
E
March 31, 2006
STK Control #ML0039
1
Rev 1.0
U630H16XS
Block Diagram
EEPROM Array 32 x (64 x 8) STORE Row Decoder A5 A6 A7 A8 A9 SRAM Array 32 Rows x 64 x 8 Columns RECALL VCC VSS
DQ0 DQ1 Input Buffers DQ2 DQ3 DQ4 DQ5 DQ6 DQ7
Column I/O Column Decoder
Store/ Recall Control
VCC
A0 A1 A2 A3 A4 A10
G NE E W
Truth Table for SRAM Operations Operating Mode Standby/not selected Internal Read Read Write * H or L Characteristics
All voltages are referenced to VSS = 0 V (ground). All characteristics are valid in the power supply voltage range and in the operating temperature range specified. Dynamic measurements are based on a rise and fall time of 5 ns, measured between 10 % and 90 % of VI, as well as input levels of VIL = 0 V and VIH = 3 V. The timing reference level of all input and output signals is 1.5 V, with the exception of the tdis-times and ten-times, in which cases transition is measured 200 mV from steady-state voltage.
E H L L L
NE
*
W
*
G
*
DQ0 - DQ7 High-Z High-Z Data Outputs Low-Z Data Inputs High-Z
H H H
H H L
H L
*
Absolute Maximum Ratingsa Power Supply Voltage Input Voltage Output Voltage Power Dissipation Operating Temperature C-Type K-Type A-Type
Symbol VCC VI VO PD Ta Tstg
Min. -0.5 -0.3 -0.3
Max. 7 VCC+0.5 VCC+0.5 1
Unit V V V W C C C C
0 -40 -40 -65
70 85 85 150
Storage Temperature
a: Stresses greater than those listed under Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at condition above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
STK Control #ML0039
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Rev 1.0
March 31, 2006
U630H16XS
Recommended Operating Conditions Power Supply Voltage Input Low Voltage Input High Voltage Symbol VCC VIL VIH -2 V at Pulse Width 10 ns permitted Conditions Min. 4.5 -0.3 2.2 Max. 5.5 0.8 VCC+0.3 Unit V V V
C-Type DC Characteristics Operating Supply Currentb Symbol ICC1 VCC VIL VIH tc tc tc Average Supply Current during STOREc ICC2 VCC E W VIL VIH VCC E tc tc tc Average Supply Current at tcR = 200 nsb (Cycling CMOS Input Levels) Standby Supply Currentd (Stable CMOS Input Levels) ICC3 VCC W VIL VIH VCC E VIL VIH Conditions = 5.5 V = 0.8 V = 2.2 V = 25 ns = 35 ns = 45 ns = 5.5 V VCC-0.2 V VCC-0.2 V 0.2 V VCC-0.2 V = 5.5 V VIH = 25 ns = 35 ns = 45 ns = 5.5 V VCC-0.2 V 0.2 V VCC-0.2 V = 5.5 V VCC-0.2 V 0.2 V VCC-0.2 V 30# 23# 20# 15# 90# 80# 75# 6# Min. Max.
K-Type Min. Max.
A-Type Min. Max. Unit
95# 85# 80# 7#
85# 7#
mA mA mA mA
Standby Supply Currentd (Cycling TTL Input Levels)
ICC(SB)1
34# 27# 23# 15#
27# 15#
mA mA mA mA
ICC(SB)
1#
1#
2#
mA
b: ICC1 and ICC3 are dependent on output loading and cycle rate. The specified values are obtained with outputs unloaded. The current ICC1 is measured for WRITE/READ - ratio of 1/2. c: ICC2 is the average current required for the duration of the STORE cycle (STORE Cycle Time). d: Bringing E VIH will not produce standby current levels until any nonvolatile cycle in progress has timed out. See MODE SELECTION table. The current ICC(SB)1 is measured for WRITE/READ - ratio of 1/2.
March 31, 2006
STK Control #ML0039
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Rev 1.0
U630H16XS
Symbol VCC IOH IOL VCC VOH VOL VCC High Low Output Leakage Current High at Three-State- Output Low at Three-State- Output IOHZ IOLZ IIH IIL VIH VIL VCC VOH VOL Conditions = 4.5 V =-4 mA = 8 mA = 4.5 V = 2.4 V = 0.4 V = 5.5 V = 5.5 V = 0V = 5.5 V = 5.5 V = 0V 1 -1 A A 1 -1 A A Min. Max. Unit
DC Characteristics Output High Voltage Output Low Voltage Output High Current Output Low Current Input Leakage Current
VOH VOL IOH IOL
2.4# 0.4# -4# 8#
V V mA mA
SRAM Memory Operations
No. 1 2 3 4 5 6 7 8 9
Switching Characteristics Read Cycle Read Cycle Timef Address Access Time to Data Validg Chip Enable Access Time to Data Valid Output Enable Access Time to Data Valid E HIGH to Output in High-Zh G HIGH to Output in High-Zh E LOW to Output in Low-Z G LOW to Output in Low-Z Output Hold Time after Addr. Changeg
Symbol Alt. tAVAV tAVQV tELQV tGLQV tEHQZ tGHQZ tELQX tGLQX tAXQX tELICCH tEHICCL IEC tcR ta(A) ta(E) ta(G) tdis(E) tdis(G) ten(E) ten(G) tv(A) tPU tPD 5# 0# 3# 0#
25
35
45 Unit
Min. Max. Min. Max. Min. Max. 25# 25# 25# 12# 13# 13# 5# 0# 3# 0# 25# 35# 35# 35 35 20# 17# 17# 5# 0# 3# 0# 45# 45# 45# 45# 25# 20# 20# ns ns ns ns ns ns ns ns ns ns ns
10 Chip Enable to Power Activee 11 Chip Disable to Power Standbyd, e
e: f: g: h: Parameter guaranteed but not tested. Device is continuously selected with E and G both LOW. Address valid prior to or coincident with E transition LOW. Measured 200 mV from steady state output voltage.
STK Control #ML0039
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March 31, 2006
U630H16XS
Read Cycle 1: Ai-controlled (during Read cycle: E = G = VIL, W = NE = VIH)f
tcR
(1)
Ai DQi
Output Previous Data Valid tv(A) (9)
Address Valid ta(A) (2) Output Data Valid
Read Cycle 2: G-, E-controlled (during Read cycle: W = NE = VIH)g
tcR (1)
Ai E G DQi
Output
Address Valid ta(A) (2) ta(E) (3) ten(E) (7) ta(G) (4) ten(G) (8) High Impedance tPU (10) ACTIVE STANDBY Output Data Valid tPD (11) tdis(E)
(5)
tdis(G) (6)
ICC
No. Switching Characteristics Write Cycle 12 Write Cycle Time 13 Write Pulse Width 14 Write Pulse Width Setup Time 15 Address Setup Time 16 Address Valid to End of Write 17 Chip Enable Setup Time 18 Chip Enable to End of Write 19 Data Setup Time to End of Write 20 Data Hold Time after End of Write 21 Address Hold after End of Write 22 W LOW to Output in High-Zh, i 23 W HIGH to Output in Low-Z
Symbol Alt. #1 Alt. #2 tAVAV tWLWH tWLEH tAVWL tAVWH tELWH tELEH tDVWH tWHDX tWHAX tWLQZ tWHQX tDVEH tEHDX tEHAX tAVEL tAVAV IEC tcW tw(W) tsu(W) tsu(A)
25
35
45 Unit
Min. Max. Min. Max. Min. Max. 25# 20# 20# 0# 35# 30# 30# 0# 30# 30# 30 18 0# 0# 10# 5# 5# 13# 5# 45# 35# 35# 0# 35# 35# 35# 20# 0# 0# 15# ns ns ns ns ns ns ns ns ns ns ns ns
tAVEH tsu(A-WH) 20# tsu(E) tw(E) tsu(D) th(D) th(A) tdis(W) ten(W) 20# 20# 12# 0# 0#
March 31, 2006
STK Control #ML0039
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Rev 1.0
U630H16XS
Write Cycle #1: W-controlledj
tcW
(12)
Ai E W
tsu(A)
Address Valid tsu(E) (17) tsu(A-WH) (16) tw(W) (13) tsu(D) (19) tdis(W)
(22)
th(A) (21)
DQi
Input
(15)
th(D) (20)
DQi
Output
Previous Data
Input Data Valid ten(W) (23) High Impedance
Write Cycle #2: E-controlledj
tcW (12)
Ai E W DQi
Input ten(E) (7) tsu(A) (15)
Address Valid tw(E) (18) tsu(W) (14) tsu(D) (19) tdis(W) (22)
th(A) (21)
th(D) (20)
Input Data Valid High Impedance
DQi
Output
undefined
L- to H-level
H- to L-level
i: j:
If W is LOW and when E goes LOW, the outputs remain in the high impedance state. E or W and NE must be > VIH during address transitions.
STK Control #ML0039
6
Rev 1.0
March 31, 2006
U630H16XS
Nonvolatile Memory Operations
No. 24
STORE Cycle Inhibit and Automatic Power Up RECALL Power Up RECALL Durationk, e Low Voltage Trigger Level
Symbol Min. Alt. tRESTORE VSWITCH 4.0 IEC 650 4.5 s V Max. Unit
k:
tRESTORE starts from the time VCC rises above VSWITCH.
STORE Cycle Inhibit and Automatic Power Up RECALL VCC 5.0 V VSWITCH
t STORE inhibit Power Up RECALL
(24)
tRESTORE
Mode Selection
E L L L L * H or L
l:
W H L L H
G L H L H
NE L L L
*
Mode Nonvolatile RECALL Nonvolatile STORE No operation
Power Active ICC2 Active
Notes l
An automatic RECALL also takes place at power up, starting when VCC exceeds VSWITCH and takes tRESTORE. VCC must not drop below VSWITCH once it has been exceeded for the RECALL to function properly.
March 31, 2006
STK Control #ML0039
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Rev 1.0
U630H16XS
STORE Cycles Symbol No. STORE Cycle W-controlled Alt. 25 26 27 28 29 STORE Cycle Timem STORE Initiation Cycle Timen Output Disable Setup to NE Fall NE Setup Chip Enable Setup tWLQX tWLNH tGHNL tNLWL tELWL IEC td(W)S tw(W)S tsu(G)S tsu(N)S tsu(E)S 25# 5# 5# 5# 10# ms ns ns ns ns Min. Max. Unit
STORE Cycle: W-controlledo NE G W E DQi
Output tsu(E)S (29) td(W)S (25) High Impedance
tsu(G)S tsu(N)S
(27) (28)
tw(W)S (26)
Symbol No. STORE Cycle E-controlled Alt. 30 31 32 33 34 STORE Cycle Time STORE Initiation Cycle Time Output Disable Setup to E Fall NE Setup Write Enable Setup tELQXS tELNHS tGHEL tNLEL tWLEL IEC td(E)S tw(E)S tsu(G)S tsu(N)S tsu(W)S 25# 5# 5# 5# 10 ms ns ns ns ns Min. Max. Unit
STORE Cycle: E-controlledo
tsu(N)S
(33)
NE G W E DQi
Output
tsu(G)S (32) tsu(W)S (34) tw(E)S (31) td(E)S (30) High Impedance
STK Control #ML0039
8
Rev 1.0
March 31, 2006
U630H16XS
RECALL Cycles Symbol No. RECALL Cycle NE-controlled Alt. 35 36 37 38 39 40 RECALL Cycle Timep RECALL Initiation Cycle Timeq Output Enable Setup Write Enable Setup Chip Enable Setup NE Fall to Output Inactive tNLQX tNLNH tGLNL tWHNL tELNL tNLQZ IEC td(N)R tw(N)R tsu(G)R tsu(W)R tsu(E)R tdis(N)R 25# 5# 5# 5# 25# 20# s ns ns ns ns ns Min. Max. Unit
RECALL Cycle: NE-controlledo NE
tsu(G)R tw(N)R (36)
G W E
(37)
tsu(W)R
(38)
tdis(N)R (40) td(N)R (35) High Impedance
tsu(E)R (39)
DQi
Output
Symbol No. RECALL Cycle E-controlled Alt. 41 42 43 44 45 RECALL Cycle Time RECALL Initiation Cycle Time NE Setup Output Enable Setup Write Enable Setup tELQXR tELNHR tNLEL tGLEL tWHEL IEC td(E)R tw(E)R tsu(N)R tsu(G)R tsu(W)R 25# 5# 5# 5# 20 s ns ns ns ns Min. Max. Unit
RECALL Cycle: E-controlledo
tsu(N)R
NE G W E DQi
Output
(43)
tsu(G)R (44)
tsu(W)R
(45)
tw(E)R (42) td(E)R (41)
High Impedance
March 31, 2006
STK Control #ML0039
9
Rev 1.0
U630H16XS
Symbol No. RECALL Cycle G-controlled Alt. 46 47 48 49 50 RECALL Cycle Time RECALL Initiation Cycle Time NE Setup Write Enable Setup Chip Enable Setup tGLQXR tGLNH tNLGL tWHGL tELGL IEC td(G)R tw(G)R tsu(N)R tsu(W)R tsu(E)R 25# 5# 5# 5# 20# s ns ns ns ns Min. Max. Unit
RECALL Cycle: G-controlledo, r
tsu(N)R
NE G
(48)
tw(G)R (47)
W E DQi
Output
tsu(W)R (49) tsu(E)R (50) td(G)R (46) High Impedance
m: Measured with W and NE both returned HIGH, and G returned LOW. Note that STORE cycles are inhibited/aborted by V CC < VSWITCH (STORE inhibit). n: Once tw(W)S has been satisfied by NE, G, W and E, the STORE cycle is completed automatically. Any of NE, G, W and E may be used to terminate the STORE initiation cycle. o: If E is LOW for any period of time in which W is HIGH while G and NE are LOW, than a RECALL cycle may be initiated. For E-controlled STORE during tw(E)S W, G, NE have to be static. p: Measured with W and NE both HIGH, and G and E LOW. q: Once tw(N)R has been satisfied by NE, G, W and E, the RECALL cycle is completed automatically. Any of NE, G or E may be used to terminate the RECALL initiation cycle. r: If W is LOW at any point in which both E and NE are LOW and G is HIGH, than a STORE cycle will be initiated instead of a RECALL.
STK Control #ML0039
10
Rev 1.0
March 31, 2006
U630H16XS
Test Configuration for Functional Check
5V VCCt
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10
Input level according to the
relevant test measurement
ment of all 8 output pads
VIH
VIL
Simultaneous measure-
DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7
480
VO 30 pF s 255
NE E W G
VSS
s: In measurement of tdis-times and ten-times the capacitance is 5 pF. t: Between VCC and VSS must be connected a high frequency bypass capacitor 0.1 F to avoid disturbances.
Capacitancee Input Capacitance Output Capacitance
Conditions VCC VI f Ta = 5.0 V = VSS = 1 MHz = 25 C
Symbol CI CO
Min.
Max. 8 7
Unit pF pF
All pads not under test must be connected with ground by capacitors. Ordering Code Example Type bare die Access Time 25 = 25 ns 35 = 35 ns 45 = 45 ns U630H16 XS C 25
Operating Temperature Range C = 0 to 70 C K = -40 to 85 C A = -40 to 125 C (only 35 ns)
Bonding Instructions The U630H16XS has 30 relevant bond pads and 4 additional pads. The 4 additional pads must not be bonded. Refer to the bond pad location and identification table for a complete list of bond pads and coordinates. It is mandatory to use a bond wire on each VCC and two bond wires on VSS bond pad for noise immunity. The backside of the die is connected to VCC and can be contacted with the substrate in case of the same potential. The pad VBND has to be connected with VCC in order to enable the HardStore mode of the chip. March 31, 2006 STK Control #ML0039 11 Rev 1.0
U630H16XS
Bond pad location and identification table (origin: down left corner)
Pad A2 A1 A0 DQ0 DQ1 DQ2 VSS VSS VCC DQ3 DQ4 DQ5 DQ6 DQ7 E A10 x / m 135 135 405 960 1170 1445 1650 1810 2000 2215 2490 2700 2975 3185 3460 3460 y / m 365 175 140 140 140 140 140 140 140 140 140 140 140 140 175 365 A3 A4 A5 A6 A7 NE VCC VCC VBND W A8 A9 W G Pad x / m 135 135 370 560 770 1150 1545 1685 1860 2565 3035 3225 3460 3460 y / m 1940 2130 2130 2130 2130 2130 2130 2130 2130 2130 2130 2130 2130 1940
A5 A4
A6
A7
NE
VCC
VBND
W
A8
A9 W
A3
G
Wafer diameter: Wafer thickness: Die size: Bond pad size: Passivation openings:
150 mm (39010)m (3.73 x 2.37) mm (stepping interval) (110 x 110) m (100 x 100) m (40.5) m
A2
A10
Polyimidpassivation:
A1 A0 DQ0 DQ1 DQ2 VSS VCC DQ3 DQ4 DQ5 DQ6 DQ7
E
STK Control #ML0039
12
Rev 1.0
March 31, 2006
U630H16XS
Chip Operation The U630H16 has two separate modes of operation: SRAM mode and nonvolatile mode, determined by the state of the NE pad. In SRAM mode, the memory operates as a standard fast static RAM. In nonvolatile mode, data is transferred from SRAM to EEPROM (the STORE operation) or from EEPROM to SRAM (the RECALL operation). In this mode SRAM functions are disabled. SRAM READ The U630H16 performs a READ cycle whenever E and G are LOW while W and NE are HIGH. The address specified on pads A0 - A10 determines which of the 2048 data bytes will be accessed. When the READ is initiated by an address transition, the outputs will be valid after a delay of tcR. If the READ is initiated by E or G, the outputs will be valid at ta(E) or at ta(G), whichever is later. The data outputs will repeatedly respond to address changes within the tcR access time without the need for transition on any control input pads, and will remain valid until another address change or until E or G is brought HIGH or W or NE is brought LOW. SRAM WRITE A WRITE cycle is performed whenever E and W are LOW and NE is HIGH. The address inputs must be stable prior to entering the WRITE cycle and must remain stable until either E or W goes HIGH at the end of the cycle. The data on pads DQ0 - 7 will be written into the memory if it is valid tsu(D) before the end of a W controlled WRITE or tsu(D) before the end of an E controlled WRITE. It is recommended that G is kept HIGH during the entire WRITE cycle to avoid data bus contention on the common I/O lines. If G is left LOW, internal circuitry will turn off the output buffers tdis(W) after W goes LOW. Noise Consideration The U630H16 is a high speed memory and therefore must have a high frequency bypass capacitor of approximately 0.1 F connected between VCC and VSS using leads and traces that are as short as possible. As with all high speed CMOS ICs, normal carefull routing of power, ground and signals will help prevent noise problems. Hardware Nonvolatile STORE A STORE cycle is performed when NE, E and W are LOW while G is HIGH. While any sequence to achieve this state will initiate a STORE, only W initiation and E initiation are practical without risking an unintentional SRAM WRITE that would disturb SRAM data. During a March 31, 2006 STK Control #ML0039 13 STORE cycle, previous nonvolatile data is erased and the SRAM contents are then programmed into nonvolatile elements. Once a STORE cycle is initiated, further input and output is disabled and the DQ0 - 7 pads are tristated until the cycle is completed. If E and G are LOW and W and NE are HIGH at the end of the cycle, a READ will be performed and the outputs will go active, indicating the end of the STORE. Hardware Nonvolatile RECALL A RECALL cycle is performed when E, G and NE are LOW while W is HIGH. Like the STORE cycle, RECALL is initiated when the last of the three clock-signals goes to the RECALL state. Once initiated, the RECALL cycle will take RECALL Cycle Time" to complete, during which all inputs are ignored. When the RECALL completes, any READ or WRITE state on the input pads will take effect. Internally, RECALL is a two step procedure. First, the SRAM data is cleared and second, the nonvolatile information is transferred into the SRAM cells. The RECALL in no way alters the data in the nonvolatile cells. The nonvolatile data can be recalled an unlimited number of times. Like the STORE cycle, a transition must occur on some control pads to cause a RECALL, preventing inadvertend multi-triggering. Automatic Power Up RECALL On power up, once VCC exceeds the sense voltage of VSWITCH, a RECALL cycle is automatically initiated. The voltage on the VCC pad must not drop below VSWITCH once it has risen above it in order for the RECALL to operate properly. Due to this automatic RECALL, SRAM operation cannot commence until tRESTORE after VCC exceeds VSWITCH. If the U630H16 is in a WRITE state at the end of power up RECALL, the SRAM data will be corrupted. To help avoid this situation, a 10 K resistor should be connected between W and system VCC. Hardware Protection The U630H16 offers two levels of protection to suppress inadvertent STORE cycles. If the control signals (E, G, W and NE) remain in the STORE condition at the end of a STORE cycle, a second STORE cycle will not be started. The STORE (or RECALL) will be initiated only after a transition on any one of these signals to the required state. In addition to multi-trigger protection, the U630H16 offers hardware protection through VCC Sense. When VCC < VSWITCH the externally initiated STORE operation will be inhibited.
Rev 1.0
U630H16XS
Low Average Active Power The U630H16 has been designed to draw significantly less power when E is LOW (chip enabled) but the access cycle time is longer than 55 ns. When E is HIGH the chip consumes only standby current. The overall average current drawn by the part depends on the following items: 1. CMOS or TTL input levels 2. the time during which the chip is disabled (E HIGH) 3. the cycle time for accesses (E LOW) 4. the ratio of READs to WRITEs 5. the operating temperature 6. the VCC level
The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. STK Control #ML0039 14 Rev 1.0 March 31, 2006
U630H16XS
LIFE SUPPORT POLICY ZMD products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the ZMD product could create a situation where personal injury or death may occur. Components used in life-support devices or systems must be expressly authorized by ZMD for such purpose.
LIMITED WARRANTY The information in this document has been carefully checked and is believed to be reliable. However Zentrum Mikroelektronik Dresden AG (ZMD) makes no guarantee or warranty concerning the accuracy of said information and shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it. The information in this document describes the type of component and shall not be considered as assured characteristics. ZMD does not guarantee that the use of any information contained herein will not infringe upon the patent, trademark, copyright, mask work right or other rights of third parties, and no patent or licence is implied hereby. This document does not in any way extent ZMD's warranty on any product beyond that set forth in its standard terms and conditions of sale. ZMD reserves terms of delivery and reserves the right to make changes in the products or specifications, or both, presented in this publication at any time and without notice.
March 31, 2006
Change record
Date/Rev 01.11.2001 11.08.2003 20.04.2004 7.4.2005 Name Ivonne Steffens Matthias Schniebel Matthias Schniebel Stefan Gunther Change format revision and release for Memory CD 2002" adding A-Type with ICC1 = 85mA; ICC2 = 7mA; ICC3 = 15mA; ICC(SB) = 2mA; ICC(SB)1 = 27 mA adding Leadfree Green Package" to ordering information adding Device Marking" changing to 106 endurance cycles and 100a data retention, delete ESD classes, change ordering code, PDIP 300 on special request, RoHS and Pb- free added, C/K limitation for PDIP deleted converted into bare die data sheet based on old version of June 11th 2001 Assigned Simtek Document Control Number
7.4.2005 1.0
Steffen Buschbeck Simtek

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